Bridging the Skills Gap Through Innovation Internships at Dow

Addressing the skills gap in the packaging industry requires forward-thinking programmes that foster both technical expertise and cross-disciplinary collaboration. At Dow, this commitment is reflected in two flagship internship initiatives: the Industrial Innovation Campus (I2C) and the Advanced Digital Internship for Scientists & Engineers (ADISE). 

The I2C programme offers 6–9 months of hands-on experience to outstanding master’s students in Engineering, Chemistry, Material Science, and Physics within the Technical Support and Development (TS&D) department of Dow’s Packaging and Specialty Plastics business in EMEA. Complementing this, the ADISE programme targets students with hybrid skill sets—combining disciplines such as chemical engineering and data science—to help integrate digital capabilities across the organisation. 

Both internships provide access to advanced training, mentorship from experienced professionals, and the opportunity to lead innovation projects with tangible business impact. In addition to gaining industry experience, participants build international networks and often use their project work as the foundation for their master’s theses. 

Through these initiatives, Dow aims to empower the next generation of talents to ask the right questions and contribute meaningfully to a more sustainable future.